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Processes and tools used to design
printed circuit boards vary from company to company. Variations
of design flows are too numerous to list but typically involve all
or some of the following:
Design and architecture specification
• HW architecture description
• Cost analysis
• Interface and bandwidth definitions
• SW programming sequences
• EMI design practices
Design Entry
• Graphical design entry from company libraries
• Symbol and part number generation if necessary
• Simulatable vhdl or verilog netlist generation
• Build netlist generation
• BOM generation
• Parts list generation
Purchasing and Vendors
• Preferred vendor lists
• Cost negotiations
• Part obsolescent avoidance
Simulation philosophy (full, partial, none)
• Manual timing analysis
• Functional rtl and gates (min, typ, max) for fpga's
• Models with timing (min, typ, max) for glue logic
from company libraries (or download: memories for instance)
• HW models or BFM's with timing for
complicated ASSP's
• Test writing, self checking environment
• Post layout signal integrity analysis
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Mechanical
• Board shape, connector placement, etc
• System level faraday enclosures
Manufacturing
• Design for test issues (bed of nails, jtag, etc)
• Interaction with layout house (or on site), oversee layout
• - Interaction with board assembly house
Systems integration
• Debug with the SW team
• EMI testing
• Thermal testing
• High reliability mixed digital and analog subsystem design
• System architecture analysis and specification development
• Advocating logic, hardware, and software co design
• Communications and control applications leveraging FPGA logic
• Design for fault isolation and diagnostic visibility
• Design using worst case and failure modes and effects analysis
• Layout specifications for EMC and reduced EMI
• Circuit Board Design and Layout:
• Built for test ASIC/FPGA evaluation circuit board design
• Reference design and breadboard circuit boards
• Layout specifications for EMC and reduced EMI
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